ODAKE PUR Hot Melt Adhesive CT3847: High-Performance Solution for Professional E-Ink Screen Edge Sealing

In the field of high-end electronics manufacturing, the performance requirements for adhesives in e-ink screen edge sealing are extremely stringent. ODAKE PUR Hot Melt Adhesive CT3847, designed specifically for demanding environments, has become the preferred PUR adhesive for numerous electronics manufacturers due to its exceptional waterproof sealing, temperature shock resistance, and chemical tolerance. This article details how this ODAKE PUR hot melt adhesive passes multiple rigorous tests to provide a reliable bonding solution for e-ink screen edge sealing.

Why Choose ODAKE PUR Adhesive for E-Ink Screen Edge Sealing?

E-ink screen edge sealing adhesives must meet multiple requirements, and ODAKE CT3847 excels in these key aspects:

1. Comprehensive Environmental Resistance Tests Passed

• ✅ Waterproof Sealing Test: Complete sealing to prevent moisture penetration.

• ✅ Thermal Shock Test: Stable performance after cycling between -20℃ and 60℃ for 3 hours.

• ✅ High Temperature & Humidity Test: No abnormalities after 96 hours at 60℃ and 90% RH.

• ✅ Chemical Resistance Test: Unaffected by artificial sweat immersion for 48 hours.

• ✅ Boiling Water Resistance: Maintains bonding strength after 30 minutes in 100℃ water.

• ✅ Salt Spray Test: No corrosion after 72 hours in a salt spray environment.

These test results demonstrate the reliability of ODAKE PUR Hot Melt Adhesive in extreme environments, making it an ideal choice for e-ink screen edge sealing.

Core Performance Parameters of ODAKE PUR Hot Melt Adhesive CT3847

Based on product TDS data, the key technical parameters of CT3847 support its high-performance:

These parameters collectively ensure the outstanding performance of ODAKE edge sealing adhesive in e-ink screen sealing applications.

Multi-Material Bonding Capability: Applications Beyond E-Ink Screens

ODAKE PUR Hot Melt Adhesive CT3847 is not only suitable for e-ink screen edge sealing but also widely supports various material combinations:

1. Plastic to Metal Bonding

• ABS to stainless steel

• PBT to aluminum alloy

• Nylon fiberglass to galvanized sheet

2. Glass to Plastic Bonding

• Chemically strengthened glass to ABS

• Tempered glass to PC

• Glass to PMMA

3. Metal to Metal Bonding

• Stainless steel to aluminum alloy

• Copper part to steel part

Learn more about ODAKE PUR Hot Melt Adhesive application cases by referring to our Electronic Manufacturing Bonding Solutions.

Technical Advantages Behind Rigorous Testing

1. Moisture-Curing Mechanism

ODAKE CT3847 utilizes moisture-curing technology, initiating the curing reaction upon contact with moisture in the air. This mechanism ensures:

• Remains liquid during application for easy operation.

• Forms a dense cross-linked structure after curing.

• Provides long-term stable bonding performance.

2. Higher Reliability

Compared to traditional solvent-based adhesives, ODAKE PUR Hot Melt Adhesive:

• Contains no toxic volatiles, ensuring environmental safety.

• Exhibits no shrinkage during curing, maintaining dimensional stability.

• Complies with international standards such as REACH and ROHS.

For more information on chemical safety standards, please refer to the European Chemicals Agency (ECHA) official website.

Wide Range of Industry Applications

ODAKE PUR Hot Melt Adhesive CT3847 has been successfully applied in multiple high-end manufacturing fields:

Consumer Electronics Industry

• Bonding for smartphone and tablet frames

• Encapsulation for smartwatch screens

• Structural fixation for headphones

Automotive Electronics Field

• Edge sealing for in-vehicle displays

• Waterproof sealing for sensors

• Bonding and fixation for interior components

Industrial & Electromechanical Equipment

• Encapsulation for instruments and meters

• Insulation fixation for motors

• Bonding for control panels

Explore more industry application cases for ODAKE PUR Adhesive.

Application Guidelines and Precautions

To ensure optimal performance of ODAKE PUR Hot Melt Adhesive CT3847, please note:

1. Application Environment Requirements

• Ambient temperature: 15-30℃

• Relative humidity: 40-80% RH

• Substrate surfaces must be clean and dry.

2. Curing Condition Control

• Initial curing time: 20-30 minutes (exposed to air)

• Full curing: 24 hours (at 25℃, 70-75% RH)

• Accelerated curing: Increase environmental humidity and temperature.

3. Storage & Shelf Life

• Storage conditions: Dry and cool place.

• Shelf life: 9 months.

• Seal after use.

Download the complete CT3847 Technical Data Sheet (TDS) for detailed application guidance.

ODAKE PUR Hot Melt Adhesive CT3847 has become the preferred solution for e-ink screen edge sealing and high-end electronics manufacturing due to its exceptional waterproof sealing performance, wide temperature range adaptability, and excellent multi-material bonding capability. Whether facing strict environmental requirements or complex usage conditions, ODAKE edge sealing adhesive provides reliable and long-lasting bonding assurance.

To learn more about ODAKE PUR Hot Melt Adhesive products, please visit our PUR Adhesive Series Product Page, or contact our technical team directly for personalized solutions.