ODAKE CT6829 Epoxy Structural Adhesive is a high-performance, two-component epoxy adhesive system composed of Component A (adhesive resin) and Component B (curing agent/catalyst). This solvent-free epoxy adhesive offers outstanding thermal conductivity, mechanical strength, and long-lasting structural bonding. After mixing, it cures at either room temperature or elevated temperatures, delivering a shrink-free, durable bond.
Engineered for demanding industrial applications, this thermally conductive epoxy adhesive complies with strict global standards, including ASTM, REACH, and RoHS certifications (see ODAKE Certifications).
Widely trusted by professionals, the ODAKE epoxy adhesive series is ideal for electronics assembly, instrumentation, automotive components, chemical pipeline bonding, and industrial equipment maintenance—making it a go-to solution for applications requiring high thermal performance and structural reliability.
Safe and non-toxic
High Thermal Conductivity
Strong Adhesion on Diverse Substrates
Excellent Mechanical Properties
Performs reliably in extreme environments from -50°C to 180°C
50ML/piece
Glue A and glue B should be stored separately in a dry, low-temperature, light-proof environment. The unopened shelf life is 6 months.
ODAKE CT6829 epoxy structural adhesive can effectively bond metals (steel, aluminum, copper), ceramics, glass, wood, hard plastics, etc., and is widely used in bonding, sealing and structural repair in various industries, especially suitable for high temperature or high heat environment.
Typical Applications:
Electronics & Electrical Equipment
Automotive Parts
Industrial Machinery & Motors
Household Appliances & Consumer Electronics
Aerospace, Tools, and Sporting Equipment
| Property | CT6829 Glue A | CT6829 Glue B |
|---|---|---|
| Before curing | ||
| – Color | White | Gray |
| – Appearance | semi-fluid | |
| After curing | ||
| – AB mixed initial solid (h) | 60 min | |
| – Full solid (hours) | 24 | |
| – Temperature range (°C) | -50~140 | |
| – Hardness (Shore A) | 83~85 | |
| – Thermal conductivity | 1.4 W/m·K | |
| – Weight mixing ratio | 2:01 | |
| – Shear tensile strength (MPa) | 18 | |
Disclaimer
The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.
A glue and B glue may become thicker in low temperature environment.Heating can be used to accelerate the curing of AB glue:
Heating at 80℃ for 24 hours will reach 100% strength,
Heating at 120℃ for 6 hours will reach 100% strength.
*We respect your confidentiality and all information is protected.
ODAKE is a trademark of Hexun Xinwang Adhesive.
We will arrange for a specialist to contact you immediately.
