ODAKE CT6822 Epoxy Structural Adhesive is a high-performance, two-component epoxy adhesive system composed of Component A (adhesive resin) and Component B (curing agent/catalyst). This solvent-free epoxy adhesive offers outstanding thermal conductivity, mechanical strength, and long-lasting structural bonding. After mixing, it cures at either room temperature or elevated temperatures, delivering a shrink-free, durable bond.
Engineered for demanding industrial applications, this thermally conductive epoxy adhesive complies with strict global standards, including ASTM, REACH, and RoHS certifications (see ODAKE Certifications).
Widely trusted by professionals, the ODAKE epoxy adhesive series is ideal for electronics assembly, instrumentation, automotive components, chemical pipeline bonding, and industrial equipment maintenance—making it a go-to solution for applications requiring high thermal performance and structural reliability.
Safe and non-toxic
High Thermal Conductivity
Strong Adhesion on Diverse Substrates
Excellent Mechanical Properties
Performs reliably in extreme environments from -50°C to 180°C
50ML/piece
Glue A and glue B should be stored separately in a dry, low-temperature, light-proof environment. The unopened shelf life is 6 months.
ODAKE CT6822 epoxy structural adhesive effectively bonds a wide range of substrates. These include metals (steel, aluminum, copper), ceramics, glass, wood, and hard plastics. As a result, industries widely use it for bonding, sealing, and structural repair. Moreover, it performs especially well in high-temperature or high-heat environments.
Therefore, you will find this adhesive in a variety of demanding applications, such as:
Electronics & Electrical Equipment
Automotive Parts
Industrial Machinery & Motors
Household Appliances & Consumer Electronics
Aerospace, Tools, and Sporting Equipment
| Property | CT6822 Glue A | CT6822 Glue B |
|---|---|---|
| Before curing | ||
| – Color | White | Gray |
| – Appearance | semi-fluid | |
| After curing | ||
| – AB mixed initial solid (h) | 60 min | |
| – Full solid (hours) | 24 | |
| – Temperature range (°C) | -50~140 | |
| – Hardness (Shore A) | 83~85 | |
| – Thermal conductivity | 1.4 W/m·K | |
| – Weight mixing ratio | 2:01 | |
| – Shear tensile strength (MPa) | 18 | |
The data provided in this document are representative values. Specifically, we derived them from actual measurements and routine testing. However, Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company.
Moreover, due to variations in application conditions, you should adapt the above information to your specific circumstances. Therefore, Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.
Please note that A glue and B glue may thicken in low-temperature environments. In that case, you can apply heat to accelerate the curing of AB glue.
Specifically, the adhesive reaches 100% strength under the following conditions:
Heating at 80°C for 24 hours
Heating at 120°C for 6 hours
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