ODAKE CT860 adhesive uv Series

The ODAKE  CT860 adhesive uv Series is an advanced dual-cure conformal coating adhesive designed for superior protection of electronic components, printed circuit boards (PCBs), and industrial assemblies. This high-performance formulation cures rapidly upon exposure to UV light, with secondary curing triggered by ambient moisture, ensuring complete coverage even in shadowed or hard-to-reach areas.

With its moderate viscosity, the CT860 Series supports flexible application methods including spraying, brushing, and selective dispensing, making it ideal for both manual and automated production lines.

Features

Fast curing speed
Good surface drying
Moisture resistance
Salt spray resistance
UV light and humidified air dual curing
Support spraying, brushing and selective dispensing

Packing

50ML/tube (CT8608)

250ML/can.1KG/can, 5KG/can (CT8601, CT8602)

Storage and shelf live

Store in a dry, tightly closed place at 20 to 25°C. 12 months in unopened container

Usage and precautions

  1. Please read the product MSDS carefully before use;
  2.  Process flow: incoming material inspection → coating material preparation → removal of impurities on the PCBA surface → coating (manual brushing/mechanical spraying, etc.) → UV curing → testing curing conditions;
  3.  Curing conditions: one is UV curing (fast curing under sufficient intensity UV light); the other is moisture curing.
  4.  Avoid putting leftover product back into the original packaging.
  5. Avoid contact with skin. If contact occurs accidentally, please rinse immediately with alcohol or water. If it splashes into eyes, please rinse immediately with plenty of water. If serious, please seek medical attention.

Provides reliable insulation and sealing for integrated circuits, electronic components, and solder joints。

It is widely used in:

  • 3C electronic products (computers, communications, and consumer electronics)

  • New energy vehicles (NEVs)

  • Semiconductor packaging and chip protection

Product ModelCT8601CT8602CT8608
AppearanceColorless to light yellow transparent liquid (fluorescent)Colorless transparent liquid (fluorescent)Slightly yellow paste, transparent after curing
Initial solidification time9-11 seconds6-9 seconds
Curing methodUV light and humidified air dual curing
Viscosity mPa*s17083-89
Operating temperature-40℃~120℃
Applicable materialsMainly used in the field of new energy vehicles to protect various electronic components and welding points of integrated circuitsMainly used in 3C electronic products to protect various electronic components and welding points of integrated circuitsSuitable for bonding various materials and structures Suitable for semiconductor chip protection
Product PerformancehaveModerate viscosity, spraying, brushing Suitable for a variety of processes, fast curing speed, good surface drying,Moisture and salt spray resistant, environmentally friendly and safe adhesive, easy to use and simple to operate. It is specially developed for rapid construction and rapid curing production processHigh-level protective coating materialsThe product has good compatibility with general industrial solders, no-clean solder pastes, electroplated metals, components and substrates.
Packing Specifications1KG/can, 5KG/can30ML/50ML
CertificateROHS certification,REACH certification

Disclaimer

The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.

  1. UV light curing: When exposed to UV light of sufficient intensity, it can cure quickly. (The curing speed varies with the intensity of the UV lamp, the light distance, the spectral distribution of the light source, the exposure time, and the light transmittance of the substrate.)
  2.  Moisture curing: The length of moisture curing time is closely related to the relative humidity. When the relative humidity is high, the curing time can be reduced.

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