ODAKE CT7487 RTV Silicone is a high-performance, single-component LCD Module RTV adhesive specifically engineered for fast room-temperature curing. Upon exposure to ambient moisture, it cures into a durable, rubber-like elastomer, delivering both strong adhesion and flexible protection.
This neutral-cure silicone adhesive offers excellent bonding strength and long-term reliability, making it an ideal solution for electronic device assembly, particularly in LCD/LED modules, PCBs, and other sensitive electronic components.
Fully compliant with REACH and RoHS regulations, ODAKECT7487 is non-toxic, environmentally friendly, and safe for use in a wide range of industrial and electronic manufacturing applications (see ODAKE Certifications).
Choose ODAKE CT7487 rtv Silicone for superior performance, moisture resistance, and dependable protection in high-precision electronics.
Excellent Encapsulation & Adhesion
High Flexibility
Dust, Moisture, and Gas Protection
High and low temperature resistance
300ml/tube
Store in a cool and dry place (non-toxic and harmless, treat as general chemicals),
Unopened shelf life is 6 months (room temperature below 18 degrees Celsius).
ODAKE LCD Module Protective RTV Silicone is specifically designed for the protection and sealing of sensitive electronic components, providing a durable, flexible, and reliable barrier against environmental hazards.
LCD/LED Modules: Protects LCD/LED modules from dust, moisture, and harmful gases.
IC Protection: Safeguards integrated circuits (ICs) from environmental exposure.
PCB (Printed Circuit Board) Protection: Ideal for encapsulating PCBs to protect them from dust, moisture, and other harmful elements.
Product model | CT7487 | |
| Product test results | Test standards | |
| Color | Black | — |
| Viscosity 25ºC, mPa ·S | Flowing | GB/T 10247-2008 |
| Density 25ºC, g/cm3 | 1.00±0.05 | GB/T 13354-92 |
| Surface drying time 25ºC, RH: 50%, min | .5-15 | GB/T134775-2002 |
| Hardness Shore A | 18-25 | GB/T 531.1-2008 |
| Thermal conductivity w/m ·k | 0.22-0.28 | GB/T 10297-1998 |
| Expansion coefficient µm/(m,ºC) | 210 | GB/T 20673-2006 |
| Water absorption 24h, 25ºC, % | 0.01-0.03 | GB/T 8810-2005 |
| Tear elongation % | ≥100 | GB/T 528-1998 |
| Tensile strength MPa | ≥0.9 | GB/T 528-1998 |
| Shear strength Mpa-aluminum/aluminum | ≥0.92 | GB 6328-86 |
| Dielectric strength Kv/mm(25ºC) | ≥19 | GB/T 1693-2007 |
| Volume resistivity (DC500V), Ω · cm | 1.5×1014 | GB/T 1692-92 |
Note: The above product curing data are all obtained at a temperature of 25°C and a relative humidity of 50±5%, after curing for 7 days.
Disclaimer
The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.
Room temperature curing, the overall curing of the glue depends on the contact area between the glue and the air and the thickness of the glue, larger the contact area with the air, the thinner the glue, the faster the overall curing, on the contrary, the overall curing is slower.
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