ODAKE CT7487 RTV Silicone is a high-performance, single-component LCD Module RTV adhesive specifically engineered for fast room-temperature curing. Upon exposure to ambient moisture, it cures into a durable, rubber-like elastomer, delivering both strong adhesion and flexible protection.
This neutral-cure silicone adhesive offers excellent bonding strength and long-term reliability, making it an ideal solution for electronic device assembly, particularly in LCD/LED modules, PCBs, and other sensitive electronic components.
Fully compliant with REACH and RoHS regulations, ODAKECT7487 is non-toxic, environmentally friendly, and safe for use in a wide range of industrial and electronic manufacturing applications (see ODAKE Certifications).
Choose ODAKE CT7487 rtv Silicone for superior performance, moisture resistance, and dependable protection in high-precision electronics.
Excellent Encapsulation & Adhesion
High Flexibility
Dust, Moisture, and Gas Protection
High and low temperature resistance
300ml/tube
Store in a cool and dry place (non-toxic and harmless, treat as general chemicals),
Unopened shelf life is 6 months (room temperature below 18 degrees Celsius).
We have prepared the technical data in this document based on actual measurements and routine tests conducted in our laboratory. These values are representative and intended as a general reference.
Please be aware that we cannot guarantee results obtained under conditions or methods that we have not specifically approved.
Since every application environment is unique, we recommend that you verify the product’s performance under your own production conditions.
Therefore, Hexu Xinwang cannot be held liable for any loss or damage—including lost profits—that may arise from the use of this information or product in individual cases. If you have any questions or need technical support, please contact us at any time.
ODAKE LCD Module Protective RTV Silicone is specially designed for the protection and sealing of sensitive electronic components. We formulated it to provide a durable, flexible, and reliable barrier against environmental hazards.
Typical Applications
LCD/LED Modules – protects display modules from dust, moisture, and harmful gases
IC Protection – safeguards integrated circuits from environmental exposure
PCB Encapsulation – ideal for coating circuit boards to resist dust, moisture, and contaminants
Product model | CT7487 | |
| Product test results | Test standards | |
| Color | Black | — |
| Viscosity 25ºC, mPa ·S | Flowing | GB/T 10247-2008 |
| Density 25ºC, g/cm3 | 1.00±0.05 | GB/T 13354-92 |
| Surface drying time 25ºC, RH: 50%, min | .5-15 | GB/T134775-2002 |
| Hardness Shore A | 18-25 | GB/T 531.1-2008 |
| Thermal conductivity w/m ·k | 0.22-0.28 | GB/T 10297-1998 |
| Expansion coefficient µm/(m,ºC) | 210 | GB/T 20673-2006 |
| Water absorption 24h, 25ºC, % | 0.01-0.03 | GB/T 8810-2005 |
| Tear elongation % | ≥100 | GB/T 528-1998 |
| Tensile strength MPa | ≥0.9 | GB/T 528-1998 |
| Shear strength Mpa-aluminum/aluminum | ≥0.92 | GB 6328-86 |
| Dielectric strength Kv/mm(25ºC) | ≥19 | GB/T 1693-2007 |
| Volume resistivity (DC500V), Ω · cm | 1.5×1014 | GB/T 1692-92 |
Note: The above product curing data are all obtained at a temperature of 25°C and a relative humidity of 50±5%, after curing for 7 days.
Disclaimer
The technical data in this document are representative values. We obtained them through actual measurements and routine testing conducted in our laboratory.
Please note that we do not accept responsibility for any data obtained by unauthorized personnel or through testing methods that we have not approved.
Furthermore, because application conditions vary widely, you should adapt the information provided here to your specific production environment and processes.
Accordingly, Hexu Xinwang assumes no liability for individual cases. This includes, but is not limited to, any loss of profits or other consequential damages arising from the use of this product.
This product cures at room temperature. The overall curing speed depends on two key factors: the contact area between the adhesive and air, and the thickness of the adhesive layer.
Specifically, a larger air contact area and a thinner adhesive layer will accelerate overall curing. Conversely, a smaller air contact area and a thicker layer will slow down the curing process. Therefore, we recommend adjusting the application thickness according to your specific production needs to achieve optimal curing results.
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