ODAKE CT766 Thermally Gel Series

ODAKE CT766 Thermal Gel Series is a specially formulated, silicone-based thermally conductive gel that utilizes advanced composite fillers to deliver superior thermal conductivity and electrical insulation.

This high-performance thermal gel offers low oil permeability, outstanding resistance to high and low temperatures, and excellent durability against moisture, ozone, and weathering. These properties make it ideal for maintaining reliable thermal management in demanding environments.

Commonly used as a thermal interface material (TIM), the ODAKE CT766 Thermal Gel Series efficiently transfers heat between power components—such as power transistors, thyristor rectifiers, and heating stacks—and heat dissipation devices like heat sinks, thermally conductive plates, and housings.

Features

Excellent thermal conductivity

Electrical insulation

Non-toxic and environmentally friendly

High and low temperature resistance.

Water, ozone, weather and corrosion resistance

Packing

300ML/piece

Storage and shelf live

Please store in a cool and dry place, shelf life is 9 months.

Usage and precautions

  1. Clean the surface of the target component, squeeze out the thermal conductive gel with a glue gun, and evenly apply it to the surface of the component;
  2. When applying it to the surface of the component, the gap should be reduced to ensure the heat dissipation effect. Clean the dust and oil on the surface of the bonded material;
  3. The adhesive on the surface of the bonding material must be evenly distributed.the amount of glue applied should not be too much, so as not to increase the cost and affect the appearance of the product. After the operation is completed, the thermal conductive gel should be in close contact with the component.
  4. The operation must be carried out in a well-ventilated environment.

ODAKE CT766 Thermally Conductive Gel Series is a versatile thermal management solution that can be applied between heat generating components and heat dissipation solutions in various devices.

Primary Applications Include:

Smartphone CPUs and Memory Chips

Power Modules

Integrated Chips and Electronic Controllers

Power Supply Modules

Automotive Electronics and Controllers

Telecommunication Equipment

Computers and Related Accessories

Product ModelCT766ACT766B
ColorPink
AppearancePaste
Density (g/cm3)2.65~2.852.72-2.92
Curing time min 60℃240
Curing time min 100℃50-70
Temperature range ℃-60~200
Hardness (Shore A)67~7768~78
Tensile strength (Mpa) ≥0.25
Volume resistivity (Ω.cm) ≥1.0×1013
Breakdown voltage (MV/m) ≥12
Dielectric strength (kV/mm)13
Flame retardant standardUL94V-0
Compatibility with PC materialIncompatible
Thermal conductivity (Thermal conductivity w/m.k)23

Disclaimer

The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.

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