ODAKE CT778 Thermally Conductive Gel is a one-component, ready-to-use thermal interface material (TIM) designed for efficient heat dissipation in high-power electronic devices. This thermal gel offers excellent thermal stability, high dielectric strength, and is both non-corrosive and non-volatile, making it an environmentally friendly solution.
With a high thermal conductivity of 8.0 W/m·K, the soft, paste-like gel effectively fills microscopic gaps between heat-generating components and heat sinks or housings, ensuring rapid and reliable heat transfer under low assembly pressures.
The product is certified to meet strict ASTM, REACH, and RoHS standards, guaranteeing safety and regulatory compliance (see ODAKE Certifications).
Single-component
High thermal conductivity: 8.0 W/m·K
Excellent electrical insulation and thermal stability
Withstands high and low temperatures
Non-toxic, non-corrosive
No curing required — apply directly, fast processing
300ML/piece
2600ML/barrel
Please store in a cool and dry place. The unopened shelf life is 9 months.
ODAKE CT778 CPU Thermal Gel is specifically developed for gap-filling and thermal transfer in power-intensive and thermally sensitive electronics. It is widely trusted by OEMs across sectors such as computing, telecom, and electric vehicles. Key applications include:
CPUs, GPUs, and power amplifiers — efficient heat dissipation
Power supply modules and power semiconductors — thermal management
5G base stations, servers, and telecom equipment — optimized thermal transfer
Battery Management Systems (BMS) and automotive control modules — heat mitigation in EVs and automotive electronics
Heatsinks, enclosures, and thermal interfaces in industrial and consumer devices
| Product model | CT778 | Test standard |
| Appearance | grey | Visual inspection |
| Density g/cm3 | 3.50±0.2 | ASTM D792 |
| Extrusion rate g/min | ≥16 | φ2.54mm/90psi |
| BLT μm | ≤200 | – |
| Dielectric strength KV/mm | ≥5 | ASTM D149 |
| Volume resistivity Ω·cm | ≥1 ×1011 | ASTM D257 |
| Weight loss % | ≤0.5 | 150℃ 240H |
| Thermal conductivity W/m·K | 8.0±0.3 | ASTM D5470 (three thickness fitting) |
| Using temperature ℃ | -40~150 | – |
| Specific heat capacity (g·K) | 0.76 | ASTM E1269 |
Disclaimer
The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.
*We respect your confidentiality and all information is protected.
ODAKE is a trademark of Hexun Xinwang Adhesive.
We will arrange for a specialist to contact you immediately.
