ODAKE CT778 Thermally Conductive Gel is a one-component, ready-to-use thermal interface material (TIM). We designed it for efficient heat dissipation in high-power electronic devices. This thermal gel offers excellent thermal stability and high dielectric strength. Furthermore, it is non-corrosive and non-volatile, making it an environmentally friendly solution.
Key Features
CT778 delivers a high thermal conductivity of 8.0 W/m·K. Its soft, paste-like texture effectively fills microscopic gaps between heat-generating components and heat sinks or housings. Therefore, it ensures rapid and reliable heat transfer even under low assembly pressures.
Safety & Compliance
This product is certified to meet strict ASTM, REACH, and RoHS standards. Accordingly, it guarantees safety and regulatory compliance (see ODAKE Certifications).
Single-component
High thermal conductivity: 8.0 W/m·K
Excellent electrical insulation and thermal stability
Withstands high and low temperatures
Non-toxic, non-corrosive
No curing required — apply directly, fast processing
300ML/piece
2600ML/barrel
Please store in a cool and dry place. The unopened shelf life is 9 months.
Surface Preparation – first, clean the bonding surface thoroughly to remove dust and oil.
Application – apply the adhesive evenly across the surface. Avoid using excessive glue, as this may increase costs and affect the product’s appearance.
Storage After Use – after completing the operation, seal any unused silicone immediately. Use the remaining product within a short period to maintain its performance.
Cleaning & Safety – uncured glue can be removed with environmentally friendly solvents. Furthermore, always operate in a well-ventilated area.
ODAKE CT778 CPU Thermal Gel – Reliable Thermal Management for Power-Sensitive Electronics
ODAKE CT778 CPU Thermal Gel is specifically developed for gap-filling and thermal transfer in power-intensive and thermally sensitive electronics. OEMs across computing, telecom, and electric vehicle sectors trust this high-performance thermal interface material.
Typical Applications
CPUs, GPUs, and power amplifiers – delivers efficient heat dissipation for high-performance processors
Power supply modules and power semiconductors – ensures reliable thermal management in power electronics
5G base stations, servers, and telecom equipment – provides optimized thermal transfer for communication infrastructure
Battery Management Systems (BMS) and automotive control modules – enables effective heat mitigation in EVs and automotive electronics
Heatsinks, enclosures, and thermal interfaces – offers reliable thermal solutions for industrial and consumer devices
| Product model | CT778 | Test standard |
| Appearance | grey | Visual inspection |
| Density g/cm3 | 3.50±0.2 | ASTM D792 |
| Extrusion rate g/min | ≥16 | φ2.54mm/90psi |
| BLT μm | ≤200 | – |
| Dielectric strength KV/mm | ≥5 | ASTM D149 |
| Volume resistivity Ω·cm | ≥1 ×1011 | ASTM D257 |
| Weight loss % | ≤0.5 | 150℃ 240H |
| Thermal conductivity W/m·K | 8.0±0.3 | ASTM D5470 (three thickness fitting) |
| Using temperature ℃ | -40~150 | – |
| Specific heat capacity (g·K) | 0.76 | ASTM E1269 |
Disclaimer
We have prepared the technical data in this document based on actual measurements and routine tests conducted in our laboratory. These values are representative and intended as a general reference.
Please be aware that we cannot guarantee results obtained under conditions or methods that we have not specifically approved.
Since every application environment is unique, we recommend that you verify the product’s performance under your own production conditions.
Therefore, Hexu Xinwang cannot be held liable for any loss or damage—including lost profits—that may arise from the use of this information or product in individual cases. If you have any questions or need technical support, please contact us at any time.
📧 Mail：hexuxinwang@odakeglue.com
📞 Telephone：+86-769-81617120 | +86-13711910698
📍 Address：No. 23, Lane 12, Longyan East Road, Humen Town, Dongguan City, Guangdong Province
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