ODAKE Liquid PUR Adhesive Series

ODAKE Liquid PUR Adhesive Series is a one-component, 100% solids, moisture-curing reactive hot melt adhesive with adjustable strength and flexibility and excellent adhesion to plastics and metals.
Resistant to heat, cold, water, abrasion, chemicals and aging.
Suitable for demanding applications in industries such as electronics, automotive, textiles, electromechanical equipment and aerospace.

Features

Bond, seal,
Insulate, moisture-proof
Chemical and weather-resistant
Compatible with a wide range of materials
Flexible adhesive film is easy to rework and clean to remove

Packing

30ML/piece

Storage and shelf live

Store in a cool, dry place, unopened for 6 months

Usage and precautions

  1. Cut the nozzle to desired size, attach to a dispensing gun, and apply. Cures at room temperature. Reseal after use.
  2. Ensure the adhesive is exposed to air during application. Greater surface exposure accelerates curing.
  3. Thicker layers cure more slowly. Higher temperature (max 60°C) and humidity speed up curing.
  4. Store and transport in a dry, cool place. Avoid direct sunlight and high temperatures.

Ideal for:

  • Smartphone frames and touchscreens (TP modules)

  • Phone cases and tablet assemblies

  • Earphones and wearable devices

  • Electronic displays and components

  • Cosmetic packaging (e.g., makeup compacts)

  • Automotive interior and exterior parts

  • Crafts made from various materials

  • Sports equipment and fitness devices

Product modelCT3841CT3846
AppearanceTransparent liquid
Specific gravity1.0~1.02
Surface drying time(MIN)  20-30
Fully solid 25℃ 70%-75%RH, fully cured in 7 days24hours
Temperature range-30~120
Hardness  JIS A45-50D70~80
Viscosity  mPa.S5000~80006000~7000
Elongation at break (%)≥460300~460
Tensile strength  kgf/cm210~15
Volume resistivity  Ω cm≥1×1014
Shear strength  Mpa≥≥9.52.0-3.8
Peel strength  kn/m2.9
Strength of breakdown voltage  kv/mm18~25
Dielectric loss 1MHZ≤4×10-3

Disclaimer

The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.

  1. UV light curing: When exposed to UV light of sufficient intensity, it can cure quickly. (The curing speed varies with the intensity of the UV lamp, the light distance, the spectral distribution of the light source, the exposure time, and the light transmittance of the substrate.)
  2.  Moisture curing: The length of moisture curing time is closely related to the relative humidity. When the relative humidity is high, the curing time can be reduced.

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