ODAKE One Part Epoxy Structural Adhesives

Product Overview

ODAKE One Part Epoxy Structural Adhesives Series is a high‑performance, thermosetting adhesive. We designed it for robust structural bonding across a wide range of substrates, including metals, plastics, and ceramics. This one‑component epoxy offers exceptional mechanical strength, outstanding impact resistance, and superior crack resistance. Therefore, it ensures durable and reliable bonds in demanding industrial environments.

Safety & Compliance

This epoxy adhesive meets strict international quality and safety standards. It is also non‑toxic and environmentally friendly. Furthermore, it fully complies with global regulations such as RoHS and REACH. Its excellent thermal and chemical resistance makes it ideal for electronics assembly, industrial manufacturing, automotive components, and heavy machinery applications.

Key Features

The single‑component system offers ease of use, strong adhesion, and excellent gap‑filling properties. Consequently, it enables efficient structural bonding and encapsulation. As a result, it reduces assembly time and improves overall product reliability.

Features

ODAKE One Part Epoxy Structural Adhesives Series delivers exceptional performance with the following key benefits:

  • Non‑toxic and environmentally responsible – safe for use and compliant with global environmental standards

  • Single‑component, heat‑curable – eliminates mixing errors and simplifies the production process

  • High bond strength – ensures durable, load‑bearing structural bonds across multiple substrates

  • High temperature resistance with no corrosion – maintains integrity under heat and protects metal surfaces

  • Excellent toughness and insulation – resists impact and vibration while providing reliable electrical insulation

Packing

30ml/tube
50ml/tube

Storage and shelf live

Store below -20 degrees, long-term use(CT361,CT371,CT373);

Store below 5 degrees, long-term use(CT363).

Store at 2-8 degrees for 180 days(CT375).

Usage and precautions

Before Use – bring the adhesive to room temperature before opening. Do not open the package until the material has fully acclimated. We recommend at least 2 hours for CT361, CT371, CT373, CT375, and 4 hours for CT363.

During Application – work in a well‑ventilated area. Avoid prolonged exposure to air after opening. Furthermore, keep the recommended working environment relative humidity below 60%. Do not exceed three heating cycles.

Safety Precautions – avoid contact with skin. If accidental contact occurs, wash immediately with soapy water. If splashed into eyes, rinse with plenty of water and seek medical attention. Lastly, keep this product out of reach of children.

ODAKE one‑component epoxy structural adhesive series is designed for heat curing. We formulated it for applications that require precision, durability, and thermal stability. Therefore, it is particularly suitable for bonding delicate and heat‑sensitive electronic components.

Typical Applications

  • Electric Motors – provides durable bonding for motor assemblies and components

  • Electronic Components – ensures precise, reliable bonding for sensitive electronics

  • Semiconductors & Chips – delivers thermal stability for chip and semiconductor packaging

  • Automotive Parts – offers high‑strength bonding for automotive assemblies

  • Mechanical Assemblies – provides structural integrity for demanding mechanical applications

Product modelCT361CT371CT373CT375CT363 
Sample curing statusCuring at 80℃ for 6 minutesCuring at 150℃ for 30 minutesCuring at 80℃ for 6 minutesCuring at 80℃ for 30 minutes
Physical propertiesTypical valueTest standard
ColorBlack liquid/
Hardness (Shore D)72857672GB/T 2411-1980
Shear strength (MPa)1626262716GB/T 7124-2008
Elongation at break (%)2GB  1040-1992
Glass transition temperature (℃)112116148112GB 19466.2-2004
Coefficient of thermal expansion< Tg  50< Tg  50(10- 6/℃(Tg 以下)< Tg  24ASTM E831-86
> Tg  160> Tg   185
Water absorption (%)0.12 (24h@25℃)0.16(24h@25℃)0.56( wt% ,ASTM570)GB/T 1034-1998
Dielectric constant/dielectric loss1KHz: 3.3/0.021KHz: 5.45/0.038GB/T 1693-2007
100KHz: 3.0/0.031MHz: 4.41/0.056
Dielectric strength (KV/mm)26.531.526.5GB1408.1-1999
Ty iu Surface resistance (Ω)2.1×10151.5×10152.1×1015GB/T 1410-2006
Volume resistance (Ω.cm)2.1×10152.3×10172.1×1015GB/T 1410-2006

Disclaimer

The technical data in this document are representative values. We obtained them through actual measurements and routine testing conducted in our laboratory.

Please note that we do not accept responsibility for any data obtained by unauthorized personnel or through testing methods that we have not approved.

Furthermore, because application conditions vary widely, you should adapt the information provided here to your specific production environment and processes.

Accordingly, Hexu Xinwang assumes no liability for individual cases. This includes, but is not limited to, any loss of profits or other consequential damages arising from the use of this product.

ODAKE one‑component epoxy structural adhesive series cures under heat. The curing speed and final bond strength depend on the heating temperature and time. Specifically, higher temperatures result in shorter curing times.

Recommended curing parameters:

 
 
ModelCuring Time
CT361 / CT37380°C: 6‑8 min | 90°C: 4‑6 min
CT36380°C: 30 min | 100°C: 7‑10 min
CT371130°C: 45 min | 140°C: 30 min | 150°C: 25 min
CT375120°C: 60 min | 150°C: 30 min

Process Note

After heating, the adhesive reacts and cures rapidly. However, the actual curing speed and strength depend on the heating temperature and time. Therefore, we recommend adjusting the temperature and time according to your specific heating equipment and the bonded materials to achieve optimal process parameters.

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