ODAKE Thermal Adhesive Epoxy Series is a two-component, room-temperature or heat-curable epoxy resin adhesive engineered for high-performance electronic and electrical applications. This versatile thermal epoxy offers excellent thermal conductivity, electrical insulation, and environmental protection, making it ideal for components that require efficient heat dissipation such as power supplies, electric motor coils, and electronic devices.
The adhesive provides strong bonding to a wide range of substrates including polycarbonate (PC), polypropylene (PP), ABS, PVC, and metals. Once cured, it delivers reliable performance in temperatures ranging from -40°C to 140°C and fully complies with EU RoHS directives, ensuring safety and environmental compliance (see ODAKE Certifications).
Choose ODAKE Thermal Adhesive Epoxy Series for durable, high-efficiency thermal management in demanding electronic assemblies.
Excellent Adhesion & Bonding Strength
Non-Toxic & Eco-Friendly
High Thermal Conductivity
Superior Electrical Insulation
Moisture, Vibration, and Shock Resistance
UV and Aging Resistance
Keep away from light and heat, seal tightly, and store in a cool and dry place below 28°C (can be transported and stored as non-dangerous goods)
ODAKE Thermal Gel Epoxy Resin Adhesive Glue Series is primarily used for potting and encapsulating electronic components that require efficient heat management and protection against environmental stress. It is particularly suitable for industries that demand high-temperature resistance, moisture protection, and long-term stability.
Typical Applications Include:
Power Supplies and Power Modules
Electric Motor Coils
Lighting Systems and LED Drivers
Electrical Components for industrial and consumer electronics
Automotive and High-Voltage Equipment
PCBs and Electronic Circuits
Telecommunication Devices
Product Model | CT7622 | CT5826 | ||||
| Component A | Component B | Component A | Component B | Inspection Standards | ||
Before curing | Appearance | Black fluid | Tan fluid | Black fluid | Transparent fluid | Q/ZS 1-2016 |
| Viscosity (cps) | 13000±2000 | 20±10 | 20000±2000 | 20±10 | GB/T 10247 | |
| Mix ratio A:B (weight ratio) | 5 ∶ 1 | 10 ∶ 1 | Q/ZS 1-2016 | |||
| Packaging specifications | 5kg/can | 1kg/bottle | 1kg/can | 100g/bottle | ||
| 25kg/barrel | 5kg/barrel | 5kg/barrel | 500g/bottle | |||
| Shelf life | 6 months (store in a cool, dry place below 28°C) | 12 months (store in a cool, dry place below 28°C) | ||||
| Viscosity after mixing (cps) | 1500～3000 | 2000～5000 | GB/T 10247 | |||
| Applicable time at room temperature (min) | 40±10 | Q/ZS 1-2016 | ||||
| Typical curing time | 24h@25℃ or 2h@80℃ | |||||
After curing | Hardness | 83±2 | GB/T 531-200 | |||
| Thermal conductivity (W/m·k) | 1.0-1.5 | 1.0-1.1 | GB/T 10294-2008 | |||
Disclaimer
The data provided in this document are representative values derived from actual measurements and routine testing. Hexu Xinwang assumes no responsibility for data obtained through unauthorized personnel or testing methods not approved by the company. Due to variations in application conditions, the above information should be adapted to the user’s specific circumstances. Hexu Xinwang accepts no liability for individual cases, including, but not limited to, any loss of profits.
Mixing Procedure
Measure the required amount of Part A and Part B according to the recommended mixing ratio. Pour each component into a clean, dry container, and stir thoroughly in one direction to ensure a uniform mixture. Vacuum degas the mixed material to remove air bubbles before applying.
⚠️ Avoid reintroducing any mixed or contaminated material back into the original containers of Part A or B. Seal and store components separately after use.
Mixing Tips
Stir along one consistent direction to minimize air entrapment.
Scrape and mix material along the sides and bottom of the container to prevent incomplete curing due to uneven mixing.
The larger the mixed batch, the shorter the pot life will be.
Higher ambient temperatures will accelerate the curing process, so adjust working time accordingly.
Curing Conditions
The material can cure at room temperature or faster under elevated temperatures. Choose the curing method based on production needs and substrate characteristics.
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